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PCB Assembly Professional

منذ 3 أسابيع Multimedia Saïda   28 الآراء

-- دج

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موقعك: Saïda
السعر: -- دج

PCB Assembly 鈼?Product Introduction: With the continuous progress and development of the electronics industry, SMT has become more mature and equipment functions have been continuously improved. SMT has gradually become the most popular process technology in the electronics assembly industry. cnospcb is very experienced in BGA(Ball Grid Array) assembly, X-ray/AOI and other high-tech methods help our products 100% pass rate. 鈼?strong>Product Specification锛?/strong> Product TypeDesktop PCBoxNotebook PCModules PCMCIACamcordersAnalog/Digital Cellular Phones PWB Type2S2P PWBAdvanced substrate>95% SMT componentsThin FR4Advanced hybrid componentsAdvanced substrates blind vias Design ObjectiveFixed Form Factor/Function at lowest costThermal Management, High speed signalsLower power consumption, Mixed analog and digitalMaximize Functions within the fixed formatMinimize component sizeMinimize size and weight Applications0.55mm pitch ASICs, QFP, BGA & modulesQFP, BGA,CBGA & CSP0.4mm pitch TQFP, TCP, BGA and modulesTQFP, TAB, CSP & Flip ChipTQFP, BGA & CSPTQFP, TAB, CSP & Flip Chip AssemblySingle sidedDouble sidedDouble sidedDouble sidedDouble sided in flexDouble sided x/RF needs Connections per sq. inch30-8040-18040-240100-260100-600100-400 鈼?strong>Product Features: 1) high density 2) Heat Conduction 3) Low inductance leads 鈼?Product Application: It is very common that BGA components cannot be used up after opening the package during SMT assembly. BGA components must be baked before the next application to capture their excellent solderability. The baking temperature is usually maintained at 125掳C. Too high a baking temperature will cause changes in the metallographic structure of the joints between the solder balls and components. There is often a separation between the solder ball and the component package, and the quality of the SMT component decreases. When the baking temperature is too low, dehumidification cannot be obtained. BGA components can be assembled after baking and cooling for 30 minutes in a natural environment. 鈼?strong>Product Detals: 鈼?Deliver 5-8 working days include shipping time 鈼?Safeguards Ordinance PCB Assembly website:http://www.szospcb.com/pcb-assembly/