Solder pallet materials Professionalمنذ شهرين - Multimedia - Salah Bey - 40 الآراء
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K), and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between 180 and 190 °C (360 and 370 °F; 450 and 460 K) are the most commonly used. Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point. Non-eutectic alloys can have markedly different solidus and liquidus temperatures, as they have distinct liquid and solid transitions. Non-eutectic mixtures often exist as a paste of solid particles in a melted matrix of the lower-melting phase as they approach high enough temperatures. In electrical work, if the joint is disturbed while in this "pasty" state before it fully solidifies, a poor electrical connection may result; use of eutectic solder reduces this problem. The pasty state of a non-eutectic solder can be exploited in plumbing, as it allows molding of the solder during cooling, e.g. for ensuring watertight joint of pipes, resulting in a so-called "wiped joint".
Solder pallet, the basic unit of surface mount assembly, is used to form the solder pallet pattern of the circuit board, that is, a combination of various solder pallet materials designed for special component types. When a solder pallet structure is not designed correctly, it is difficult, sometimes impossible, to achieve the intended solder joint. There are two words for solder pallet: Land and Pad, and are often used interchangeably; however, functionally, Land is a two-dimensional surface feature used for surface mountable components, while Pad is a three-dimensional feature used for pluggable components. As a general rule, Land does not include PTH, plated through-hole. Vias are plated through holes (PTHs) that connect different circuit layers. A blind via is a buried via that connects the outermost layer and one or more inner layers, and only connects the inner layers.
Fiberglass is a common type of fiber-reinforced plastic using glass fiber. The fibers may be randomly arranged, flattened into a sheet called a chopped strand mat, or woven into glass cloth. The plastic matrix may be a thermoset polymer matrix—most often based on thermosetting polymers such as epoxy, polyester resin, or vinyl ester resin—or a thermoplastic. Cheaper and more flexible than carbon fiber, it is stronger than many metals by weight, non-magnetic, non-conductive, transparent to electromagnetic radiation, can be molded into complex shapes, and is chemically inert under many circumstances.